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congatec – a leading vendor of embedded computing technology – extends its conga-TR4 series of COM Express modules with processors from the new AMD Ryzen Embedded R1000 series. Based on the acclaimed Zen microarchitecture, this new generation of energy-efficient processors delivers the best low-power computing performance in its class and is optimized for price sensitive markets.

Infineon Technologies AG expanded its XENSIV™ 3D magnetic sensor family TLx493D at its in-house digital trade show “Virtual Sensor Experience”. The chipmaker presented a new device for industrial and consumer applications: the TLI493D-W2BW. It uses the latest 3D Hall generation from Infineon and is housed in an extremely small wafer-level package. With an 87 percent smaller footprint and 46 percent less height than previous comparable products, the sensor opens up new design options.