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Shock and vibration resistant

congatec introduces new 11th Gen Intel Core processor based Computer-on-Modules with soldered RAM for highest shock and vibration resistance. Designed to withstand even extreme temperature ranges of -40°C to +85°C, the new COM Express Type 6 Computer-on-Modules provide full compliance for shock and vibration resistant operation in challenging transportation and mobility applications.

For battery charging and power supply: Extremely compact single-chip PMIC solution from Nordic Semiconductor at Rutronik

The Nordic nPM1100 is a dedicated power management IC with configurable dual-mode buck regulator and integrated battery charger. It is designed as a complementary component to Nordic‘s nRF52® and nRF53® series of system-on-chips to ensure reliable power supply and stable operation while maximising battery life through high efficiency and low quiescent currents.

Latest news

Tuxera and eSOL forge partnership to bring highly reliable data management to safety-critical systems

30 Jul 2021

Tuxera, a world-leader in quality-assured storage management software, and eSOL, a leading global developer of real-time embedded software solutions, announced...

USB

FTDI Introduces Evaluation Board to Accompany its Latest Generation of USB Power Delivery ICs

30 Jul 2021

To back up the company’s expertise in creating advanced semiconductor technology for USB power delivery purposes, FTDI Chip has now...

FPGAs

Microchip is First to Achieve JEDEC Qualification for a Radiation-Tolerant (RT) FPGA in a Plastic Package

30 Jul 2021

Developers of small-satellite constellations and other systems used in New Space missions must deliver both high reliability and radiation protection...

Components

World’s smallest and thinnest standard logic DHXQFN packages from Nexperia in 14, 16, 20 and 24 pins

30 Jul 2021

Nexperia, the expert in essential semiconductors, today announced the world’s smallest and lowest profile 14,16, 20 and 24 pin packages for...

Cables/Connectivity

New Configuration Tool from Bulgin Provides Important First Step When Sourcing Tailored Connector/ Cabling Solutions

28 Jul 2021

To further support its industry-leading custom solutions offering, Bulgin has now introduced an intuitive online configurator. By using the Custom...

T&M

NI Unlocks the Power of Test Data and Software at NI Connect

28 Jul 2021

NI (NASDAQ: NATI) today announced its latest product advancements designed to fuel innovation across the production process, from testing and...

STMicroelectronics Manufactures First 200mm Silicon Carbide Wafers

27 Jul 2021

STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, today announced it has manufactured...

PCBs

MIKROE introduces $79 LTE IoT 8 Click board for wearables, asset tracking, monitoring and metering

27 Jul 2021

MikroElektronika (MIKROE), the embedded solutions company that dramatically cuts development time by providing innovative hardware and software products based on...

Whitepapers

Active Battery Cell Balancing

By Kevin Scott and Sam Nork, Analog Devices, Inc.

Potting and encapsulating – avoiding voids

By Paul Whitehead, BSc CEng MIET, Strategic Accounts Manager, INTERTRONICS

Physical Size Allocations for RF Electronics in Digital Beamforming Phased Arrays

By Peter Delos Analog Devices, Inc

Improving Quality Inspections for Electronics with AI

By Vesa Tormanen, VP of Product Management and Engineering, Neurala

Home

Shock and vibration resistant

For battery charging and power supply: Extremely compact single-chip PMIC solution from Nordic Semiconductor at Rutronik

Latest news

Tuxera and eSOL forge partnership to bring highly reliable data management to safety-critical systems

FTDI Introduces Evaluation Board to Accompany its Latest Generation of USB Power Delivery ICs

Microchip is First to Achieve JEDEC Qualification for a Radiation-Tolerant (RT) FPGA in a Plastic Package

World’s smallest and thinnest standard logic DHXQFN packages from Nexperia in 14, 16, 20 and 24 pins

New Configuration Tool from Bulgin Provides Important First Step When Sourcing Tailored Connector/ Cabling Solutions

NI Unlocks the Power of Test Data and Software at NI Connect

STMicroelectronics Manufactures First 200mm Silicon Carbide Wafers

MIKROE introduces $79 LTE IoT 8 Click board for wearables, asset tracking, monitoring and metering

Whitepapers

Active Battery Cell Balancing

Potting and encapsulating – avoiding voids

Physical Size Allocations for RF Electronics in Digital Beamforming Phased Arrays

Improving Quality Inspections for Electronics with AI

Video

Sponsored

Directory

Apacer Technology B.V.

Microchip Technology Inc

Telonic Instruments Limited

Events

NI CONNECT 2021

Use Parallelism to squeeze the maximum performance from your multicore system

Edge Computing: An innovative and scalable HW/SW manycore platform for intelligent systems