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Latest news

Sondrel’s latest reference IP platform enables ultra-powerful signal and data processing SoCs to be created faster for lower costs

10 May 2021
The success of so many SoCs rests in their ability to process huge amounts of data or signals efficiently turning...

har-modular®: Modules for power, signals and data – ideally combined

10 May 2021
Device development in the industrial arena is advancing in ever shorter cycles. At the same time, devices are becoming more...

ecsn releases figures for March 2021

7 May 2021
UK & Ireland authorised (afdec) distributors cautiously welcome an uptick in bookings and Billings Releasing the latest audited UK &...

Antenova offers free tool to optimise antenna placement on a PCB

7 May 2021
Antenova Ltd, the UK-based manufacturer of antennas and RF antenna modules for M2M and the Internet of Things, has created...

eCADSTAR Release 2021.0 Connects Electronic Engineering with PCB Design

7 May 2021
Zuken announces the launch of the eCADSTAR release 2021.0. With this release, eCADSTAR 3D PCB design has been extended to...

Navitas Semiconductor, the Industry Leader in Gallium Nitride (GaN) Power ICs, to Go Public at an Enterprise Value of $1.04 Billion via Live Oak II SPAC Business Combination

7 May 2021
Navitas Semiconductor (“the Company” or “Navitas”), the industry leader in GaN Power ICs, today announced that it has entered into a...

Microchip Announces the Expansion of Its Radiation-Hardened Arm® Microcontroller (MCU) Family for Space Systems

6 May 2021
Deep space initiatives including planetary exploration, orbiter missions and space research require innovative spacecraft system technology providing connectivity and processing....

Melexis reveals compact, low-voltage 3D magnetometer for consumer applications

6 May 2021
Melexis, a global microelectronics engineering company, is targeting white goods, consumer electronics, and smart-metering applications with the MLX90392 three-axis magnetic...


Potting and encapsulating – avoiding voids

By Paul Whitehead, BSc CEng MIET, Strategic Accounts Manager, INTERTRONICS

Improving Quality Inspections for Electronics with AI

By Vesa Tormanen, VP of Product Management and Engineering, Neurala

Wireless Current Sense Circuit Floats with Sense Resistor

By Kris Lokere, Strategic applications manager for signal chain products, at ADI



Edge Computing: An innovative and scalable HW/SW manycore platform for intelligent systems

18 May 2021
In order to respond effectively to the emerging needs related to Edge Computing, new hardware and software technologies are necessary…...

JTAG Technologies’ webinar series

13 May 2021
Throughout 2021 we have planned a series of unique Webinars to help you  understand how our Boundary scan tools and...