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Latest news


Vishay Intertechnology Enhances Thick Film Chip Resistor in 1206 Case Size With Higher 0.5 W Power Rating

24 Sep 2021
Vishay Intertechnology, Inc. (NYSE: VSH) today announced that it has enhanced the Vishay Draloric RCC1206 e3 thick film chip resistor in the 1206...

New breakout boards from NeoCortec simplifies prototyping of NeoMesh ultra-low power wireless networks

24 Sep 2021
NeoCortec, manufacturer of the world’s smallest, ultra-low-power bi-directional wireless mesh network modules, today announced a family of breakout prototyping and...

STMicroelectronics Launches Highly Integrated Intelligent High-Side Drivers for Automotive Applications

23 Sep 2021
The VN9D30Q100F and VN9D5D20FN from STMicroelectronics introduce a new generation of automotive intelligent switches, the first in the market with...

Compact High Pin Count 0.8mm Pitch Mezzanine Connectors Target High-Density Industrial Systems

23 Sep 2021
Expanding their product offering for industrial markets, Harwin now announces the Archer .8 series. With a 5mm stack height, these...

Clinical-Grade AFE from Analog Devices Measures Four Vital Signs for Remote Patient Monitoring Devices

22 Sep 2021
Simplify the design of wearable remote patient monitoring (RPM) devices by measuring four vital signs with one MAX86178 triple-system vital...

Tiny Power Management IC from Analog Devices Charges Wearables and Hearables Four Times Faster

21 Sep 2021
The new MAX77659 single-inductor multiple output (SIMO) power management IC (PMIC) with integrated switch-mode buck-boost charger from Analog Devices, Inc. charges wearables,...

Omron expands low leakage MOSFET relay module range

21 Sep 2021
Omron Electronic Components Europe has released new high voltage and high current versions of its innovative T-configuration MOSFET relay modules....

Yokogawa launches extreme precision Optical Spectrum Analyzer

20 Sep 2021
Yokogawa has launched a new optical spectrum analyzer (OSA) designed to offer the extreme high precision demanded by researchers developing...


Active Battery Cell Balancing

By Kevin Scott and Sam Nork, Analog Devices, Inc.

Potting and encapsulating – avoiding voids

By Paul Whitehead, BSc CEng MIET, Strategic Accounts Manager, INTERTRONICS



Productronica 2021

16 Nov 2021
Messe Munchen are looking forward to welcoming visitors once again to Productronica. Being the world’s leading trade fair for electronics...

Why Choose Between Virtualization and Real-Time When You Can Actually Have Both

28 Sep 2021
In today’s Cloud-enabled IoT-oriented world, device functionality and multimodal operational capability is critical. Advanced products are migrating towards a hypervisor-enabled...

The 3D Printing Electronics Conference 2021

7 Dec 2021
The 3D Printing Electronics Conference covers various converging aspects of 3D printed electronics, from technological and scientific novelties to real-life...