Molex Announces New MicroTPA 2.00mm Wire-to-Board and Wire-to-Wire Connector System

Molex releases the MicroTPA 2.00mm Wire-to-Board and Wire-to-Wire Connector System, providing electrical and mechanical reliability in a high-temperature design that meets a diverse range of industry requirements. The connectors are ideal for the consumer and automotive markets needing a compact wire-to-board and wire-to-wire connector system, with a current rating up to 2.5A for use within constrained spaces.

The MicroTPA 2.00mm Wire-to-Board and Wire-to-Wire Connector System has the advantage of two to 15 circuits in a wire-to-wire connector system, acceptance of a wide range of wire sizes, crimp terminals that are already popular in the market, TPA retainers, a positive lock structure, RoHS compliant and high-temperature capabilities, vertical through-hole headers and a 2.00mm pitch.

“The new MicroTPA Connector System is designed to withstand harsh environments,” said Mariko Okamoto, global product manager, Molex. “For example, a raised bottom and ledge on the connector allows potting material to cover the entire PC board, preventing water from entering the connector and eliminating otherwise typical conductivity issues.”

Compared to similar connector systems in the market right now, the MicroTPA 2.00mm Wire-to-Board and Wire-to-Wire Connector System offers 2.5A amperage, a temperature range of -40 to +105˚C and a cable range of 0.85mm to 1.50mm.

For more information about the MicroTPA 2.00mm Wire-to-Board and Wire-to-Wire Connector System, please visit


About Molex:

Molex brings together innovation and technology to deliver electronic solutions to customers worldwide. With a presence in more than 40 countries, Molex offers a full suite of solutions and services for many markets, including data communications, consumer electronics, medical, industrial, automotive, and commercial vehicle. For more information, please visit



Molex is a registered trademark of Molex, LLC in the United States of America and may be registered in other jurisdictions.