TE Connectivity Announces Plans to Acquire ERNI Group AG

13 July 2021

TE Connectivity (TE), a world leader in connectivity and sensors, and ERNI Group AG (ERNI), a leading firm in electronic…

Andes certifies Imperas RISC-V Reference Models for the new RISC-V P (SIMD/DSP) extension

12 July 2021

Imperas Software Ltd., the leader in virtual platforms and high-performance software simulation, today announced that Andes Technology Corp., a leading…

Now at Mouser: Samtec’s COM-HPC Interconnect Solutions for AI, Industrial, IoT Applications

12 July 2021
Cables/Connectivity

Mouser Electronics, Inc., the industry’s leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components,…

Antenova introduces Lutosa, high performing antenna for small devices on LTE and 5G networks

12 July 2021
Antenna

Antenova Ltd, UK-based manufacturer of antennas and RF antenna modules for M2M and the IoT, is announcing a compact high…

TT Electronics S-2CONNECT® Creo Development Kit Leverages the Latest LTE Cat M1 and NB-IoT Technology to Accelerate R&D for Connected Applications

9 July 2021
Internet of things

TT Electronics, a global provider of engineered electronics for performance-critical applications, today announced the launch of its S-2CONNECT® Creo Development…

Toshiba announces new photovoltaic-output photocoupler with increased open voltage for isolated solid-state relays

9 July 2021
Components

Toshiba Electronics Europe GmbH (“Toshiba”) has launched a new photovoltaic-output photocoupler (“photovoltaic coupler”) housed in a thin SO6L package measuring…

M.2 cards bring u-blox wireless connectivity options to NXP evaluation boards

9 July 2021
Wireless

u-blox (SIX:UBXN), a leading global provider of positioning and wireless communication technologies, is introducing a set of Wi-Fi 5, Wi-Fi…

For power applications with high efficiency: High-efficiency ceramic capacitors of the KONNEKT™series from KEMET at Rutronik.

9 July 2021
Components

Aiming high: KEMET‘s KONNEKT™ technology is a high-density package technology that enables components to be interconnected without the use of…

Zuken’s CR-8000 2021 Advances Early Design Analysis and Reuse Functionality

7 July 2021
Design

Zuken is releasing the latest edition of CR-8000, focusing on analysis and reuse. The CR-8000 2021 release features more than…

Apacer’s Industrial DDR5 SODIMM Ushers In The Next Generation of High-Performance Computing; Expanding High-Bandwidth Industrial Applications

7 July 2021
Memory

5G’s market penetration is growing rapidly and requires processing speed upgrades that new technologies such as DDR5 can offer. DDR5…