C&K Launches Low-Profile Tactile Switch for Wearable Devices
C&K, leading manufacturer of high-quality electromechanical switches, has developed a miniature SMT tactile switch designed for wearable and portable IoT…
Ready for 5G Front-Haul Applications with DSFP Dual-Channel 112G Form Factor
Choosing the right form factor becomes easy with Yamaichi Electronics´ DSFP host connector, the worldwide first-to-market DSFP host connector. Due…
Vishay Intertechnology Infrared Sensor Module Features Extended Temperature Range for Outdoor Applications
Vishay Intertechnology, Inc. (NYSE: VSH) today introduced a new extended temperature “E” option for its TSSP77038 infrared (IR) sensor module…
STMicroelectronics Unveils Next-Generation MEMS Accelerometer for High-Performance Automotive Applications
The STMicroelectronics AIS2IH three-axis linear accelerometer brings enhanced resolution, temperature stability, and mechanical robustness to non-safety automotive applications including anti-theft, telematics, infotainment,…
Dialog Semiconductor Adds Industry’s Lowest Power Flash Devices to its IoT Portfolio
Dialog Semiconductor plc (XETRA:DLG), a leading provider of battery and power management, Wi-Fi®, Bluetooth® low energy (BLE) and Industrial edge…
EiceDRIVER™ X3 Enhanced and X3 Compact: Highly flexible and easy-to-design-in gate driver families now with reinforced isolation
Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has expanded its easy-to-design EiceDRIVER™ X3 Compact (1ED31xx) and the highly flexible…
Spectrum’s versatile Digital I/O card shrinks size and cost
The release of a new Digital I/O card from Spectrum Instrumentation offers engineers and scientists a cost-effective way to generate…
New White Chip LEDs: High Luminous Intensity (2.0cd) in a Class-Leading Small 1608 Size (Metric)
ROHM has developed ultra-compact high luminous intensity white chip LEDs, called CSL1104WB. The products are optimized for applications requiring high…
Analog Devices and MDA Collaborate to Provide Electronic Beam Forming Technology for the Telesat Lightspeed Constellation, Enhancing Global Connectivity
Analog Devices, Inc. (Nasdaq: ADI) has announced a collaboration with MDA to deliver the beam forming integrated circuit (BFIC) to be…
Renesas RX MCU Becomes World’s First General-Purpose MCU to Obtain CMVP Level 3 Certification Under NIST FIPS 140-2 Security Standard
Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced that its 32-bit RX65N microcontroller (MCU) has achieved…