Renesas Launches 5V RX660 32-Bit MCUs with Superior Noise Tolerance for Home Appliances and Industrial Applications

2 August 2022
MCU

Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced a new addition to the RX 32-bit…

Samsung Foundry Achieves 2X Productivity on Large-Scale Analog and Mixed-Signal IP with the Spectre FX Simulator

1 August 2022

Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that Samsung Foundry has deployed the Cadence® Spectre® FX Simulator for FastSPICE-based…

Mercury Electronics Europe announces new ultra-miniature ultra-low phase noise crystal oscillators

1 August 2022
Components

Mercury Electronics Europe has announced a new range of ultra-miniature, ultra-low phase noise crystal oscillators that are ideal for use…

Designing Switched-Mode Power Supplies Using a Digital Twin

1 August 2022
Design

Wide bandgap semiconductors are driving the next generation of Switched Mode Power Supplies (SMPS). They allow for greater power efficiency,…

III-V Epi meets industry demand for reduced lead time semiconductor wafer design, manufacture, test, and characterisation.

22 July 2022

III-V Epi provides a fast turnaround service for custom, compound semiconductor wafer design, manufacturing, test, and characterisation. By focusing on…

Infineon introduces NAC1080: Single-chip solution with integrated H-Bridge for passive NFC lock applications

22 July 2022
MCU

The global smart lock market size was valued at 1.38 billion USD in 2020. The demand was recorded at 8.9…

Harwin Hi-Rel Connectors Deliver Greater Board-to-Board Spacing

21 July 2022
Cables/Connectivity

To support the complete breadth of customer applications, Harwin adds another option to its popular Datamate series of high-reliability (Hi-Rel)…

Anritsu and Yotavis launch a unique open lab for communication technologies testing in Switzerland

21 July 2022

Anritsu Corporation and its authorized Swiss distributor YOTAVIS AG have launched the Swiss Communication Competence Center (SCCC), an open telecommunication…

Volkswagen’s CARIAD and STMicroelectronics to co-develop chip for software-defined vehicles

21 July 2022

New cooperation model for software-defined cars: CARIAD, the software unit of Volkswagen Group, and STMicroelectronics (NYSE: STM), a global semiconductor…

Smiths Interconnect expands DaVinci test socket offering DaVinci Micro Series reduces crosstalk issues in high-speed test

21 July 2022
T&M

Smiths Interconnect, a leading provider of innovative solutions for critical semiconductor test applications, announces the expansion of its DaVinci product…