New congatec module with i.MX 8M Plus gives Qseven designs a massive performance boost for the future
congatec – a leading vendor of embedded and edge computing technology – celebrates the 15th anniversary of Qseven Computer-on-Modules with the…
STMicroelectronics and Blues Wireless Cooperate to Accelerate Adoption of Cellular Technology in Embedded Applications
STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, and Blues Wireless, a telecoms equipment…
300W and 1,000W programmable electronic DC loads offer multiple operating modes, high-speed response times and linear start-up from 0V
TDK Corporation (TSE 6762) announces the introduction of the TDK-Lambda brand SFL series of programmable electronic DC loads. The series…
Arrow Electronics offers RBZ Robot Design’s System-on-Modules
Arrow Electronics has signed an agreement to sell RBZ Robot Design’s SIMPLIA system-on-module (SoM) series worldwide. These SoM solutions feature…
20 pins, two rows – and no smarter way for high power connections
For the sake of simplified, time- and cost-efficient assembly, there is no smarter and robust way to connect a PCB…
Murata Adds New Capabilities to its Highly Versatile id-Bridge RFID Management Solution
Leveraging the technical strength it has built up in the RFID business over more than two decades, Murata now launches…
Rohde & Schwarz introduces R&S VSESIM-VSS that combines EDA simulation with hardware testing
New wireless and satellite technologies offer ever wider frequency ranges and involve increasingly demanding requirements. Realistic signal simulation at the early…
RS and DesignSpark partner with world-leading digital manufacturer Protolabs to deliver 3D printing services
RS Components (RS), a trading brand of Electrocomponents plc (LSE: ECM), a global omni-channel product and service solutions provider for industrial…
Toshiba expand the TXZ+TM family with ARM® Cortex®-M4 microcontrollers for high-speed data processing
Toshiba Electronics Europe GmbH (“Toshiba”) announces the availability of 20 new microcontroller devices for high-speed data processing of the TXZ+TM…
Cadence and Samsung Accelerate 3nm Mixed-Signal Silicon
Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that it has collaborated with Samsung Foundry to deliver qualified Mixed-Signal OpenAccess-ready…