Infineon’s new HYPERRAM™ memory chip doubles bandwidth for low pin-count, high-performance solutions

2 August 2022
Memory

Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has added HYPERRAM™ 3.0 to its portfolio of high-bandwidth, low-pin count memory…

Advantech to showcase new AIoT and IIoT solutions at Embedded World

7 June 2022
Embedded

Embedded World 2022 will see Advantech showcase the latest embedded products, solutions and services in the areas of hardware, software,…

Computing-in-Memory Innovator Solves Speech Processing Challenges at the Edge Using Microchip’s Analog Embedded SuperFlash® Technology

19 May 2022
Memory

Computing-in-memory technology is poised to eliminate the massive data communications bottlenecks otherwise associated with performing artificial intelligence (AI) speech processing…

32-Lane PCIe 3.0 Packet Switch from Diodes Incorporated Addresses Fan-Out and Multi-Host Connectivity

18 May 2022
Switches

Diodes Incorporated (Diodes) (Nasdaq: DIOD) today announced the introduction of a PCIe® 3.0 packet switch IC. DIODES™ PI7C9X3G1632GP provides flexible…

Now Shipping from Mouser: Bosch BHI260AP Self-Learning AI Smart Sensor for Fitness Tracking

16 May 2022
Sensors

Mouser Electronics, Inc., the New Product Introduction (NPI) leader empowering innovation, is now stocking the BHI260AP self-learning AI smart sensor…

Maxim Integrated’s Multi-Phase AI Power Chipset Delivers Industry’s Highest Efficiency and Smallest Total Solution Size

20 August 2021
Power

Designers of high-performance, high-power artificial intelligence (AI) systems can now achieve highest efficiency (to reduce power cost and heat) and…

Maxim Integrated’s Hand-Held Camera Cube Reference Design Enables Artificial Intelligence at the Edge for Vision and Hearing Applications

23 July 2021
Artificial Intelligence

Today Maxim Integrated Products, Inc. (NASDAQ: MXIM) unveiled the MAXREFDES178# camera cube reference design, which demonstrates how Artificial intelligence (AI)…

Apacer Fits DDR4-3200 Memory Module into VLP DIMM Form Factors Ideal for 5G Smart Poles and Edge AI

27 May 2021
Memory

Edge computing devices are trending towards miniaturization, but need to overcome the limitations associated with smaller form factors. With this…

ADLINK Releases Industry-first Embedded MXM Graphics Modules on NVIDIA Turing™ Architecture Embedded MXM graphics modules based on Turing architecture for edge AI

11 May 2021
Design

ADLINK Technology Inc., a global leader in edge computing, today introduced the industry’s first embedded MXM-based graphics modules based on…

Renesas Launches New General-Purpose 64-Bit RZ/G2L Group of MPUs with Latest Arm Cortex-A55 for Improved AI Processing

19 January 2021
Components

 Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced the expansion of its RZ/G2 general-purpose 64-bit microprocessors…